Lood

Solder paste, which is used for microscopic, respirable computer chips, is subject to the highest quality requirements. For risk reasons, solder paste cans are often thrown away, some of which are still full but e. g. were opened more than an hour ago. The risk of malfunction is too high.

This results in large quantities of solder waste, which is not recycled. Dr. Oliver Brabänder would like to change this and is conducting intensive research on the subject. This project is about the design of an appropriate solder recycling machine. The basic principle is that the cans are placed upside down on a grid and sprayed from below. At the bottom, flux and solder settle as separate sediment layers and can be extracted isolated from each other.

Collaboration of Deggendorf Institute of Technology with Dr. Oliver Brabänder